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A novel low-temperature anodic bonding process using induction heating is presented in this paper. Anodic bonding between silicon and glass (Pyrex 7740) has been achieved at temperature below 300°C and almost bubble-free interfaces have been obtained. A 1kW 400kHz power supply is used to induce heat in graphite susceptors (simultaneously as the high-voltage electrodes of anodic bonding), which conduct...
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