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Thin copper films of about 15nm thickness were deposited on Si(111) substrates at room temperature and subsequently annealed at higher temperatures. The ellipsometric analysis was performed in situ under UHV conditions in the wavelength range 400-800nm. The as-deposited films can be described by a two-layer model taking into account the excitation of surface plasmon polaritons (SPP) at the rough copper-silicon...
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