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Sn–xZn (x=9, 25, and 50wt%) alloy solders were applied in a photovoltaic (PV) ribbon. The effects of intermetallic compounds (IMCs) on series resistance and bond reliability of Sn–xZn PV modules were investigated. Cu5Zn8 and AgZn3 IMCs were found at the interfaces (solder/Cu and solder/Ag). The Zn content in the solder dominated the growth behavior of IMCs at the interface. The IMC thickness increased...
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