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In this paper, viability of electroplated Ag film into device application was studied. Alloying behavior of the Ag film with its underlying Pd(50nm)/Ti(100nm) film stack was investigated with respect to heat treatment at different temperatures from 400°C to 800°C in an argon ambient. After annealing at 400°C, the electrical resistivity of the Ag film increased due to Pd alloying with Ag. Formation...
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