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A polycrystalline AlN underlayer prepared by reactive sputtering has been used for the preparation of SmCo3.5Cu0.5 thin films with varying thickness. The out-of-plane (OOP) texture is confirmed by X-ray diffraction and magnetic measurements. A highest ambient coercivity of 2.92 T is obtained with good squareness. The microstructure shows columnar grains and a high density of stacking faults. Additionally,...
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