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Ni is the most commonly used barrier in thermoelectric solder joints, and its role is to avoid excessive reaction between the bismuth telluride (Bi2Te3) element and the Sn-based solder. This study, for the first time, demonstrates a strong effect of the Bi2Te3 substrate on the electrodeposition of Ni layer, consequently affecting the interfacial reaction with the Sn-4 wt.% Ag-0.5 wt% Cu (SAC405) solder...
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