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The role of additives in the electroplating of copper films deposited from sulfuric acid - copper sulfate solution was investigated by the cyclic voltammetry. Strong effects of additives were found both during the underpotencial deposition and in the bulk deposition demonstrating the leveling, suppressing and accelerating abilities of these organic compounds.
Stopy magnezu jako materiał odlewniczy i konstrukcyjny, nabiera coraz większego znaczenia rynkowego i technologicznego. Jego zakres zastosowań w dużej mierze zorientowany jest w przemyśle motoryzacyjnym, lotniczym i sportowym, dzięki wciąż wzrastającym tendencjom związanym głównie z rozwojem przemysłu środków transportu. Tak popularne wykorzystywanie tego materiału spowodowane jest przede wszystkim...
Stress corrosion cracking (SCC) can cause a dangerous failure of structural parts under specific combination of material, environment and loading. For testing of the resistance to SCC at higher temperatures (100-300°C) in water environments were proposed several methods. The Drop Evaporation Test (DET) is useful for comparison and evaluation of resistance of stainless steels and related alloys to...
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