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Epoxy composites containing boron nitride (BN) or aluminum nitride (AlN or Al2N3) particles have been studied with a view to obtaining increased thermal conductivity. The effect of these fillers on the cure reaction has been investigated by differential scanning calorimetry (DSC) for two systems, epoxy-diamine and epoxy-thiol, and for volume fractions up to about 35 % of these filler particles. For...
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