Transactions of the Institute of Fluid-Flow Machinery > 2010 > nr 122 > 95-110
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journal ISSN : | 0079-3205 |
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Bibliography
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[1] Kercher D.S., Lee J., Brand O., Allen M.G., Glezer A.: Microjet cooling devices for thermal management of electronics. IEEE Trans. Comp. Pack. Technol. 26(2003), 359–366.
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[2] Wang E.N., Zhang L., Jiang L., Koo J.-M., Maveety J.G., Sanchez E.A., Goodson K.E., Kenny T.W.: Micromachined jets for liquid impingement cooling of VLSI chips. J. Microelectromech. Syst. 13(2004), 833–842.
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[3] Hayes D.J., Wallace D.B., Cox W.R.: Microjet printing of solder and polymers for multi-chip modules and chip-scale packages. Proc. SPIE Int. Conf. High Density Pack. MCMs. 3830, 1999, 242 247.