Elektronika : konstrukcje, technologie, zastosowania > 2011 > Vol. 52, nr 4 > 86-91
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journal ISSN : | 0033-2089 |
journal e-ISSN : | 2449-9528 |
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[1] Matthei G. L., Young L., Jones E. M. T.: Microwave Filters, Impedance MatchingNetworks, and Cupling Structures. McGraw-Hill, New York 1964, USA.
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[2] Alimenti R., Mezzatone P., Roselli L., Sorrentino R.: Modelling and characterization of the bonding wire interconnection. IEEE Transaction on Microwave Theory and Techniques, vol. MTT-49, 2001, pp. 142-149.
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[3] Sutono A., Cafaro N., Laskar J., Tentzeris M.: Experimental Modeling, Repeatability Investigation and Optimization of Microwave Bond Wire Interconnects. IEEE Transaction on Advanced Packaging, vol. 24, 2001, pp. 595-603.