Elektronika : konstrukcje, technologie, zastosowania > 2010 > Vol. 51, nr 9 > 117-119
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journal ISSN : | 0033-2089 |
journal e-ISSN : | 2449-9528 |
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[1] Moser Z., Gąsior W., Bukat K., Pstruś J., Kisiel R., Sitek J., Ishida K., Ohnuma I. (2007): Pb-Free Solders: Part. III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions. Journal of Phase Equilibria and Diffusion, vol. 28, no. 5, 433-438.
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[2] Bukat K., Sitek J., Moser Z., Gąsior W., Kościelski M., Pstruś J. (2008): Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance-ANOVA. Soldering & Surface Mount Technology, vol. 20, no. 4, pp. 9-19.
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[3] Bukat K., Sitek J., Kościelski M., Moser Z., Gąsior W., Pstruś J.: Investigation of Sn-Zn-Bi solders. Part II. Wetting measurements of the Sn-Zn7Bi solders on copper and on PCB with lead-free finishes by using the wetting balance method. Soldering&Surface Mount Technology, w druku.