Elektronika : konstrukcje, technologie, zastosowania > 2012 > Vol. 53, nr 1 > 103-106
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journal ISSN : | 0033-2089 |
journal e-ISSN : | 2449-9528 |
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[1] Hopkins D. C., Bhavnani S. H., Dala K. H.: Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AIN, Al2O3, and BeO Assemblies. ISHM 1992, pp. 577-583.
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[2] Lindemann A., Strauch G.: Properties of Direct Aluminum Bonded Substrates for Power Semiconductor Components. IEEE Transactions On Power Electronics, vol. 22, no. 2, March 2007, pp. 384-391.
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[3] Majumdar G.: Power Module Technology for Home Power. 2010 International Power Electronics Conference, pp. 773-777.