Archives of Materials Science and Engineering > 2009 > Vol. 40, nr 1 > 27-32
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ISSN czasopisma : | 1897-2764 |
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[1] T. Sasaki, M. Tanaka, Y. Ohno, Intermetallics compound formation between lead-free solders (Sn) and Cu or Ni electrodes, Materials Letters 55/10 (2007) 2093-2095.
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[2] G. Niewielski, D. Kuc, Structure of the copper under controlled deformation path conditions, Archives of Materials Science and Engineering 36/1 (2009) 20-27.
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[3] A. Jansson, Thermodynamic evaluation of Zn-Ni system.TRITA-MAC-0340, Materials Research Centre, Royal Institute of Technology, Stockholm, 1987.