Materials Science Poland > 2006 > Vol. 24, No. 1 > 269--278
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journal ISSN : | 2083-1331 |
journal e-ISSN : | 2083-134X |
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Bibliography
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[1] LEE D.-D., LEE D.-S., IEEE Sensors, 1 (2001), 214.
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[2] YAMAZOE N., MIURA N., IEEE Trans. Compon. Pack. A, 18 (1995), 252.
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[3] PARK C.O., AKBAR S.A., WEPPNER W., J. Mater. Sci., 38 (2003), 4639.