Przetwórstwo Tworzyw > 2010 > [R.] 16, nr 5 > 260-272
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journal ISSN : | 1429-0472 |
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Bibliography
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2. Li D., Goodwin K., Yang C.: Electroless copper deposition on aluminum - seeded ABS plastics, J. Mater. Sci. 2008, 43, 7121-7131.
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3. Tang X., Cao M., Bi C., Yan L., Zhang B.: Research on a new surface activation process for electroless plating on ABS plastic, Mater. Lett. 2008, 62, 1089-1091.