Przegląd Elektrotechniczny > 2021 > R. 97, nr 2 > 60--63
Source
Abstract
Identifiers
journal ISSN : | 0033-2097 |
journal e-ISSN : | 2449-9544 |
Authors
Keywords
Additional information
Publisher
Fields of science
Bibliography
-
[1] Aasmundtveit K.E., et al “Solid-Liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications” 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), DOI 10.1109/ECTC.2019.00029, 141-148
-
[2] Yu. F., et al “Reliability of Ag Sintering for Power Semiconductor Die Attach in High Temperature” IEEE Trans. On Power Electronics, vol.32, No 9, September 2017, DOI:10.1109/TPEL.2016.2631128
-
[3] Chew L.Ch., Schmitt W.: High reliable silver sintered joint on copper lead frame by pressure sintering process” IWIPP IEEE conference,(2019) IEEE, DOI:10.1109/IWIPP.2019.8799094, 44-47