Bulletin of the Polish Academy of Sciences. Technical Sciences > 2023 > Vol. 71, nr 2 > art. no. e145683
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journal ISSN : | 0239-7528 |
journal e-ISSN : | 2300-1917 |
DOI | 10.24425/bpasts.2023.145683 |
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Bibliography
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[2] S. Semboshi, T. Al-Kassab, R. Gemma, and R. Kirchheim, “Microstructural evolution of Cu–1 at% Ti alloy aged In a hydrogen atmosphere ant its relation with the electrical conductivity,” Ultramicroscopy, vol. 109, pp. 593–598, 2009.
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[3] S. Semboshi, T. Nishida, and H. Numakura, “Microstructure and mechanical properties of Cu–3% at. Ti alloy aged in a hydrogen atmosphere,” Mater. Sci. Eng. A-Struct., vol. 517, pp. 105–113, 2009.