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We present an overview of Infinera's current generation of 100 Gb/s transmitter and receiver PICs as well as results from the next-generation 500 Gb/s PM-QPSK PICs.
We report on the current state of large-scale and high functionality photonic integrated circuits on the InP platform for transmitters, receivers, and other device applications.
We report on development of large-scale and high functionality photonic integrated circuits on InP and Si platforms for transmitter, receiver, filtering and routing applications and discuss the merits of both platform.
We report the first demonstration of a large-scale InP-based transmitter photonic integrated circuit (PIC) capable of 10-channel times 40 Gb/s per wavelength polarization-multiplexed RZ-DQPSK modulation.
We will review the latest performance metrics for components enabling communication networks based on phase modulation formats. For spectral efficiency, reduced complexity, reliability, and power consumption; monolithic integration on InP is clearly the superior path.
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