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High-performance self-aligned inversion-channel In0.75Ga0.25As n-MOSFETs using in-situ ultra-high-vacuum (UHV) deposited Al2O3/Ga2O3(Gd2O3) and ex-situ atomic-layer-deposited (ALD) Al2O3 as gate dielectrics have been fabricated. Both devices exhibit excellent DC characteristics, including high drain currents and transconductances. A 1.2 mum-gate-length In0.75Ga0.25As MOSFET using Al2O3(2 nm-thick)/GGO(13...
Excellent electrical performances have been demonstrated for the MOSCAPs and MOSFETs using Ga2O3(Gd2O3) gate dielectrics deposited at room temperature on Ge(100) without employing any interfacial layers. In this work, we report a very low interfacial density of state (Dit) of ~2times1011cm-2 eV-1, a low leakage current density (Jg) of ~10-9A/cm2, well-behaved capacitance-voltage (C-V) characteristics...
Ultra-high vacuum (UHV)-deposited high Ga2O3(Gd2O3) was proved to passivate Ge effectively, as evidenced by comprehensive investigations including structural, chemical, and electrical analyses. The Ga2O3(Gd2O3)/Ge interface is revealed to be abrupt even being subjected to a 500degC anneal, a high kappa value of 14.5, a low leakage current density of ~10-9 A/cm2 with a Fowler-Nordheim tunneling behavior,...
Self-aligned inversion-channel In0.53Ga0.47As n-MOSFETs with ex-situ atomic-layer-deposited Al2O3 and in-situ ultra-high-vacuum deposited Al2O3/Ga2O3(Gd2O3) as gate dielectrics have been demonstrated. Both devices exhibit excellent DC characteristics, including high drain currents and transconductances. In addition, RF characteristics of both devices were analyzed; without using any isolation, non...
The authors have successfully demonstrated self-aligned high-performance inversion-channel In0.53Ga0.47As MOSFETs using UHV-deposited nano-meter thick AI2O3/GGO dual-layer dielectrics and a TiN metal gate. Record-high drain current and transconductance, despite its challenging process, were achieved. Ring gate D-mode In0.2Ga0.8As MOSFETs using as a similar dual layer gate dielectric also exhibits...
We report on the first demonstration of an enhancement-mode p-channel GaAs metal oxide field effect transistor (MOSFET) realized directly on GaAs semi-insulating substrate with a fully ion-implant technology. The device, with a 40/spl times/50 /spl mu/m/sup 2/ gate geometry, shows very good DC characteristics with transconductance of 0.3 mS/mm and an excellent gate breakdown field greater then 3 MV/cm.
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