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A potential large scale QFN package solution-plastic air-cavity QFN package, compatible with SMD assembly lines, for future low cost, miniature size and attractive performance microwave package application is proposed in this paper. A 6 GHz~18 GHz LNA MMIC (2 ?? 1mm2) is developed using a commercial GaAs pHEMT process and integrated into this novel and cost effective package solution. The measured...
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