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A low cost & feasible system on package solution on the basis of BCB and silicon wafer (10 Ohm·mm)-Si-Based 3D MMCM package solution is presented in this paper. What is more, a standard Si-Based MEMS process is employed to achieve package and revision of a GaAs-Based Monolithic Amplifier circuit. The measured results show that input return loss is less than 20 dB; moreover, small signal gain is...
A potential large scale QFN package solution-plastic air-cavity QFN package, compatible with SMD assembly lines, for future low cost, miniature size and attractive performance microwave package application is proposed in this paper. A 6 GHz~18 GHz LNA MMIC (2 ?? 1mm2) is developed using a commercial GaAs pHEMT process and integrated into this novel and cost effective package solution. The measured...
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