The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The underlying variability in the ReRAM device operation, while undesired in many applications, can be advantageous for hardware security primitives. ReRAM devices also come with the advantage of having non-linear multi-state operation. By comparison with previous reported ReRAM PUFs, which utilized spatial variations in the devices' binary ON/OFF states, we proposed to use sneak path currents and...
In this study, pioneering research was performed on GaN p-i-n diodes for the first ever assessment of surface temperature distribution by incorporating the use of infrared (IR) thermography, thermoreflectance thermal imaging, Raman thermometry, and thermal simulations. Each technique was advanced in order to obtain self-consistent results with higher accuracy. A two-temperature emissivity calibration...
A prototype of the toroidal field (TF) secondary quench detection (SQD) system was developed and implemented with the Korea Superconducting Tokamak Advanced Research (KSTAR) device to carry out the design verification of the SQD. The SQD can detect a quench based on the change of absolute pressures (APs) and mass flow rates of helium in the cooling lines of the TF coils. If the primary quench detection...
High-power wireless power transfer system (WPT) with high voltage and/or high current can be very dangerous to both engineers and consumers because the probability of explosion is much higher than that of low-power WPT system. Therefore, safety and reliability issues of a coil module in WPT systems should be verified before the actual experimental test. In this paper, a coil module verification process...
A prototype of the Toroidal Field (TF) Secondary Quench Detection system (SQD) was developed and implemented with the Korea Superconducting Tokamak Advanced Research (KSTAR) device to carry out the design verification of the SQD. The SQD can detect a quench based on the change of absolute pressures and mass flow rates of helium in the cooling lines of the TF coils. If the primary quench detection...
This paper presents a high-voltage driver in nanometer-scale, low-voltage SOI CMOS technology well beyond the voltage limits of standard devices. The drive level is near the voltage-tolerance limit of the body insulator. A novel, bidirectional, switched-capacitor output stage that combines both voltage-conversion and pulse-drive is introduced. The two-level driver is implemented in 45-nm SOI CMOS...
Parylene C neural probes with a 3D sheath structure are introduced as a novel interface for long-term intracortical neural recording. 3D sheath structures were assembled from surface micromachined Parylene microchannels by thermoforming the thermoplastic around a solid microwire mold. Multiple Pt electrodes lined the interior and exterior of the sheath. Electrochemical characterization of the electrodes...
This paper describes the design of a 48 kJ/s high-voltage capacitor charging power supply (CCPS), focusing on its efficiency, power density, and reliability. On the basis of a series-parallel resonant converter (SPRC) that provides high efficiency and high power density owing to its soft-switching, the design of the CCPS is explained in detail, including its input filter, resonant tank parameters,...
One key to enable the successful implementation of 3-D interconnects using Through-Silicon Via (TSV) is the control of the mechanical stresses. The synchrotron-sourced X-ray microdiffraction technique has been recognized to allow some important advantages compared to other techniques. Using this approach, we have studied Cu TSV samples from Hynix, Inc. as well as from SEMATECH and found interesting...
The advent of deep sub-micron technology has exacerbated reliability issues in on-chip interconnects. In particular, single event upsets, such as soft errors, and hard faults are rapidly becoming a force to be reckoned with. This spiraling trend highlights the importance of detailed analysis of these reliability hazards and the incorporation of comprehensive protection measures into all network-on-chip...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.