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Besides the stress around Cu TSV's, also the stress induced by microbumps is a main contributor to transistor level stress. For complete and successful deployment of 3D IC all effects generating stress have to be addressed. Therefore, this work quantifies the stress and its effects associated with Cu microbumps and their interaction with underfill material in 3D stacks by using a combined experimental...
The goal of this digest is to develop a quantitative understanding about the shape and the volume of tissue activated (VTA) and stimulation site by deep brain stimulation (DBS) in deep brain area like subthalamic nucleus (STN) to improve neural stimulation. Current steering approach has been used in cochlear implant systems. In this digest, a novel current steering approach is applied to deep brain...
Channel interaction generated by simultaneous electrical stimulation of neighboring electrodes is generally undesirable. However, channels interaction, or virtual channels, can be used in a controlled manner to increase the number of perceptible electrodes for retinal prosthesis patients. Virtual channels have been used successfully in the cochlear prosthesis systems to increase the number of perceptible...
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