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In this paper, we propose a system design for a laboratory test-bed of building-integrated microgrid (BIMG) to facilitate the research needs in relation to the BIMG cyber-physical control system. The system design consists of hardware part (infrastructure) and software part (control platform). Specifically, for the control platform we develop an architecture capable of easily integrate different system...
In response to ever-increasing demand for computing power, a high-end server microprocessor with two silicon die in a multi-chip module (MCM) package was planned. For the MCM microprocessor to work optimally, the two large silicon die (each with more than 10,000 C4 bumps) need to communicate efficiently with each other. This requires many copper routing traces in the organic substrate. To accommodate...
The introduction of low-k/ultra-low-k (ULK) dielectric materials to accommodate the continuous scaling-down of the feature sizes of IC chips to improve the device density and performance of the ultra-large scale integrated (ULSI) circuits represents great silicon and packaging integration challenges due to the weak mechanical properties of interlayer dielectric material (ILD). Implementation of crackstop...
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