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The silicon carbide whisker (SiCw) and silicon carbide particle (SiCp) were employed to prepare polystyrene/silicon carbide whisker/silicon carbide particle (PS/SiCw/SiCp) thermal conductivity composites, and the titanate coupling reagent of NDZ‐105 was introduced to functionalize the surface of fillers. The thermal conductive coefficient λ improved from 0.18 W/mK for native PS to 1.29 W/mK for the...
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