The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The thermal characteristics of thermally conductive underfill in flip-chip package was studied. To enhance the thermal conductivity of underfill, the epoxy was mixed with thermally conductive fillers, such as silica (1.5W/mK), alumina (36W/mK) or diamond (2000W/mK). Coefficient of thermal expansion (CTE) was changed by filler and its content and CTE was 28ppm for 60wt% silica, 39ppm for 60wt% alumina...
The thermal characteristics of thermally conductive underfill in flip chip package was studied. To enhance the thermal conductivity of underfill, the epoxy was mixed with thermally conductive fillers, such as silica (1.5W/mK), alumina (36W/mK), or diamond (2000W/mK). Coefficient of thermal expansion (CTE) was changed by filler and its content, and CTE was 28 ppm for 60 wt% silica, 39 ppm for 60 wt%...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.