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The paper deals with the propagation of EMI in Smart Power SoCs through high frequency parasitic paths, i.e. silicon substrate, and it focuses on the interaction between on-chip parasitic capacitors and package parasitic elements, that negatively affects IC electromagnetic emission. The paper highlights such unwanted parasitic effects through computer simulations and experimental test results. Finally,...
This paper deals with the experimental characterization of integrated circuit electromagnetic emissions. The influence of the IEC standardized board layout on the conducted emission of an integrated circuit has been analyzed by full-wave and circuital simulations. Guidelines for the design of such a test board which help to improve measurement repeatability are also provided.
The paper deals with the electromagnetic emissions of smart power system on chips (SoCs). The architecture of common integrated smart-power systems is described, hence the propagation of core blocks switching noise through the silicon substrate is discussed referring to simple equivalent circuits. Based on that, a new grounding scheme to reduce substrate voltage bounce is presented in detail and its...
This paper shows a new method to establish a binary data link between integrated circuits through single-ended wiring interconnects. It is based on the transmission of small (a few hundred millivolts) and short (a few hundred picoseconds) double exponential pulses from output buffers (pulse generators) to electric charge receivers. Because the power of signals handled by the new output driver and...
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