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The paper deals with the propagation of EMI in Smart Power SoCs through high frequency parasitic paths, i.e. silicon substrate, and it focuses on the interaction between on-chip parasitic capacitors and package parasitic elements, that negatively affects IC electromagnetic emission. The paper highlights such unwanted parasitic effects through computer simulations and experimental test results. Finally,...
The paper deals with the electromagnetic emissions of smart power system on chips (SoCs). The architecture of common integrated smart-power systems is described, hence the propagation of core blocks switching noise through the silicon substrate is discussed referring to simple equivalent circuits. Based on that, a new grounding scheme to reduce substrate voltage bounce is presented in detail and its...
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