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Program disturbance characteristics of 3D vertical NAND Flash cell array architecture have been investigated intensively. A new 'program Y disturbance' mode peculiar to 3D NAND Flash cell is defined. Swing characteristics of poly-Si channel and increased NOP (number of program) stress have been compared with 2D planar NAND Flash cell. In this paper, new program method pertinent to 3D NAND Flash memory...
We developed the new control gate (CG) material and structure in order to overcome scaling limitation beyond 20nm NAND flash cell. New CG material can achieve excellent gap-fill without void and improvement of the Gate CD Gap (GCG). And also, by using new CG material, CG depletion between floating gate (FG) can be improved. As a result, gate coupling ratio, bit-line (BL) interference and tail-cell...
Multi-level NAND flash memories with a 20nm design rule have been successfully developed for the first time. A 20nm rule wordline (WL) and bitline (BL) direction have been realized by Spacer Patterning Technology (SPT) of ArF immersion lithography. Key integration technologies include WL airgap with separate gate etch process and optimized control gate (CG) poly deposition process. In addition, many...
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