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We have examined printing technology to be adaptable to TSV forming process such as isolation layer forming and via fill. The result shows good possibility.
This paper discloses that Nano-Function materials make TSV structure by printing technologies without CVD/PVD/Plating. For isolation layer forming, two types of TSV pattern had been examined. For metal fill, we adopted conductive paste or alloy plate contains nanomized alloys (Cu, Sn and additives) to fill via by less than 250°C condition. Re-melting temperature of the alloy is more than 300°C.
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