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Today, applications like data center/cloud, mobility and Internet of Things (IoT) are key market drivers for semiconductor industry. To meet the requirements of next generation Information and Communication Technology (ICT) systems, the packaging technology has to evolve along with the Integrated Circuit (IC) technology scaling. At the same time, design and development of packages have to meet the...
This paper presents a novel hybrid strategy for depth map enhancement. Given a low resolution and noisy depth map, we improve its spatial resolution and quality with a registered high resolution color image. The unreliable pixels are removed firstly based on the local structure of center pixel. Then the initial depth map is mapped to color image's coordinate. And the holes created by up sampling and...
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