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The creep behavior of 95.8Sn–3.5Ag–0.7Cu shear-lap solder joints was investigated at different shear stresses ranging from 2–26 MPa and test temperatures of 25, 75, and 125°C. The stress exponent can be clearly defined in the low-stress (τ < 12 MPa) and high stress (τ > 15 MPa) ranges. The stress exponent is larger in the high-stress range, and decreases with increasing temperature in both low...
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