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Bulk material fracture and interface delamination are main failure modes observed in microelectronic components. Drivers are stresses during processing (e.g. soldering), testing (e.g. moisture sensitivity, thermal cycling) and operation in application environments. For quantitative modeling to predict failures the fracture toughness expressed as critical energy release rate Gc has to be known by measurements...
Microelectronic packages can be considered as composite structures fabricated from highly dissimilar materials. Interface delamination related failure often occurs when the packaged devices are subjected to thermo-mechanical loading. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch...
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