The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, a high efficient fiber-to-waveguide mode converter is demonstrated on the SOI platform, which is composed of a suspended tapered SiO2 waveguide and overlapped Si nano-tapers. The overlapped Si nano-tapers are located in the center of suspended tapered SiO2 waveguide. With a refractive index (<1.4) matching liquid, the coupling losses between the cleaved optical fiber and this...
This letter reports a microelectromechanical system (MEMS) lens holder serving as a key component for on-chip aligning and mechanical fixing of an optical ball lens in silicon photonics packaging. The lens holder, which consists of a suspended mass, is attached onto a previously developed MEMS active alignment platform to achieve precision alignment and fixing of a ball lens with a diameter of 300...
Polarization-independent wavelength path switching is demonstrated with one-chip silicon photonic circuit including 64 thermo-optical switch elements within 12mm × 3mm. Owing to uniformity, any path can be constructed by simply turning on one switch element.
Hybrid integration has been employed for most of the current market available silicon photonics. A novel modular packaging scheme, MEPIC-iMEP3, is proposed for rapid development and high flexibility. One of the critical modules in this packaging scheme is the multichip integration onto the i-MEP3 substrate for sub-micron accuracy. In this study, a series of specially designed test chips and test substrate...
We report the first demonstration of a waveguide-integrated avalanche photodetector using Group-IV heterostructure materials. Such device achieved a responsivity of ~0.8 A/W at unity gain and an impressive gain-bandwidth product of ~105 GHz at 1550 nm photon wavelength.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.