The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We experimentally demonstrate, for the first time, a new metallic carbon nanotube (CNT) removal technique that can be readily scaled to full-wafer-scale. Existing metallic CNT removal techniques either do not remove enough metallic CNTs, or are not VLSI-compatible, or impose very large area costs when applied to wafer-scale VLSI (up to 200%). In contrast, our new technique retains VLSI-compatibility,...
Metallic carbon nanotubes (CNTs) create source-drain shorts in Carbon Nanotube Field Effect Transistors (CNFETs) resulting in excessive leakage (Ion/Ioff < 5) and highly degraded noise margins. A new technique, VLSI-compatible Metallic-CNT Removal (VMR), overcomes metallic CNT challenges by combining layout design with CNFET processing. VMR produces CNFET circuits with Ion/Ioff in the range of...
Gate dielectric breakdown measurements were performed on high-k/metal gate and SiON/polysilicon gate NMOSFETs down to the ESD time domain. Measurements indicate that, for a given NMOSFET on-state performance level, high-k transistors have increased robustness to ESD compared to SiON transistors.
Low current and high current ESD characteristics of the Poly-Bounded and High-k Metal Gate-bounded ESD diodes with varying stress components are studied in 32 nm SOI technology. It is observed that embedded SiGe (e-SiGe) stress on the anode degrades the ESD protection performance significantly mainly due to the introduction of defects in the active region. Compressive stress liners, tensile stress...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.