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CuxBiySez thin films with copper concentration x up to 29 mol. % are synthesized on glass substrates by chemical-bath deposition. Films with thickness in the range of 550-597 nm are fabricated by a multiple-dip process. Deposition parameters for a single-coating run are optimized to avoid re-dissolution of the particles, and to obtain large-area composition homogeneity in the films. Routine film composition...
Electromigration-induced void evolutions in various dual-inlaid Copper (Cu) interconnect structures were simulated by applying a phenomenological model resorting to Monte Carlo based simulations, which considers redistribution of heterogeneously nucleated voids and/or pre-existing vacancy clusters at the Cu/dielectric cap interface during electromigration. The results indicate that this model can...
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