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We report improved planarization efficiency (ratio of step height reduction and removed layer thickness) in chemical–mechanical planarization (CMP) of copper lines at a down pressure of 2 psi. The CMP slurry used to achieve these results contains fumed silica particles (abrasive), β-alanine (surface complexing agent) and H 2 O 2 (oxidizer), combined with dissolution inhibiting ammonium...
Abrasive particles used in chemical mechanical planarization (CMP) of copper often agglomerate and cause scratches on the finished surface. Abrasive-free CMP offers a feasible solution to this problem, and our present work examines four dicarboxylic acids (oxalic, malonic, succinic and glutaric, with increasing carbon chain lengths) as possible complexing agents for such a chemically dominated CMP...
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