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Electroplated (EP) Cu films demonstrate a microstructural transition at room temperature, known as self-annealing, that involves grain growth and texture changes. In this paper, we have investigated the annealing behavior of EP Cu films grown on a Cu seed layer deposited on top of a TaN barrier layer. A grazing incident x-ray diffraction (GIXRD) pattern shows stronger x-ray reflections form Cu (111)...
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