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The article deals with investigation of IR radiation spectrum control during soldering of surface mounted devices (SMD) to printed circuit boards (PCB) by application of new kind of radiation heating equipment. It is suitable for electronic components soldering to PCB using conventional and lead free solder pastes, different kinds of annealing and others. By application of low inert radiation heaters...
The investigation presents new kind of infrared equipment for wide utilization in electronic industry. It is suitable for electronic components soldering to printed circuit boards (PCB) using conventional and lead free solder pastes, different kinds of annealing and others. Conventional reflow furnaces have their own heating profiles. The heating profile of a certain furnace is uniquely determined...
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