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Areas of application that span almost every class of microsystems technology, from electronics to energy storage devices to chemical/biochemical sensors, can benefit from options in engineering designs that exploit 3D micro/nanostructural layouts. Recently developed methods for forming such systems exploit stress release in prestretched elastomer substrates as a driving force for the assembly of 3D...
In article number 1903181, Yihui Zhang, John A. Rogers, and co‐workers propose integrating transient materials into 3D structures, which serves as the basis for an attractive route to 4D, or transformable 3D architectures and functional electronic devices. Such devices could create opportunities for unusual applications for 3D assembly techniques, such as medical devices, microbotics, and flexible...
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