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A body sensor node system-on-chip (SoC) is designed and implemented. The SoC integrates analog front end (AFE), a high-resolution analog-to-digital converter (ADC), an RF-to-DC rectifier, a low dropout (LDO) regulator, and a digital signal processing (DSP) block. The batteryless SoC is powered by RF of 2.45GHz. The rectifier generates 1.8V output and the LDO converts the voltage to stable 1.6V supply...
System Integrity Protection Schemes are being widely used to ensure the secure operation of power networks operating close to their limits. This is achieved by providing system operators with fast corrective actions. The use of digital signal processing and information and communication technologies (ICT) provides faster operation, but, requires changes in the instrumentation, monitoring, communication,...
Three-dimensional (3-D) integration promises continuous systemlevel functional scaling beyond the traditional 2-D device-level geometric scaling. It allows stacking memory dies on top of a logic die using through-silicon vias (TSVs) to realize high bandwidth by deploying the vertical connections between functional blocks. In this paper, we present a design strategy using ESL virtual platform to explore...
The three-dimensional (3-D) stacking memory is good way to extend the local memory of embedded CPU and/or DSP by the through-silicon-vias (TSVs) technology. In this work, we show a multi-core system with 3-D stacking memory, and the stacking memory can be configured as instruction cache or local data memory for each DSP core. Due to the non-cacheable property of local memory, the programmers have...
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