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The 2-stage acceleration theory based accelerated lumen depreciation test method for LED lamps/luminaires was released recently as a standard-CSA020, which can reduce the lifetime test from 6,000 hours to less than 2,000 hours. However, to perform as a methodology in the application of that method, still some concerns existed. This paper validated that methodology by experimentally investigation on...
In this paper, the effects of package level structures and material properties on solder joint reliability subjected to impact loading are investigated by the integrated experimental testing, failure analysis, and finite element modeling. Three different package structures: ball on I/O wafer level package (WLP), copper post WLP, and chip-scale (CS) ball grid array (BGA) package, are studied. Experimental...
This paper presents the fundamental understandings of the printed circuit board (PCB) dynamic behaviors under impact loading, with the use of finite element analysis for different configurations of boards. The effects of boundary conditions, and the impulse duration are also investigated. Excellent agreement is obtained between the bare board analysis and the actual component performance for the current...
In this paper, an integrated testing, finite element modeling and failure analysis approach for drop test reliability of wafer level packages is developed to examine the shock performance of large array wafer level packages. For standard JEDEC drop test, it has been found that corner component group (group A) failed first for 12 times 12 array packages. This is different from previously reported failure...
In this paper, a comprehensive study is carried out to investigate the WLP package dynamic behaviors subjected to drop impact according to the JEDEC specification. First, a Direct Acceleration Input (DAI) method, which decouples the board dynamic responses from the test system, thus avoids the difficulties in modeling the complex behaviors of contact between the drop table and drop surfaces, is introduced...
Reliability performance during drop impact is critical for electronic handheld devices. In this paper, a comprehensive study in efficiency and accuracy of multiple finite element modeling approaches and solution techniques for a wafer-level package (WLP) is presented. JEDEC specified test board is used for the model study. A direct acceleration input method is introduced. Two types of global finite...
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