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In this paper a micro-nano Cu@Ag core-shell particles were synthesized by liquid phase reduction method based on 50nm, 5µm, 20µm spherical copper powders for enhancement of Sn-10Sb high temperature solder. The as-prepared Cu@Ag core-shell particles were characterized by XRD, TEM and SEM methods, result indicated that a layer of Ag was uniformly coated on the surface of Cu. 3wt.% Cu@Ag core-shell particles...
This paper investigated effects of Cu nanoparticles addition in Sn-3.0Ag-0.5Cu solder paste on the microstructure and shear strength of the solder joints. Experimental results indicated that the microstructure of the SAC-nano Cu solder joints was composed of β-Sn dendrites and Cu6Sn5 intermetallic compounds (IMC). As the increase of the Cu nanoparticle content, the grain size of the β-Sn and Cu6Sn...
The reliability of SAC lead-free solder joints are believed to be greatly influenced by the interfacial intermetallic compounds (IMCs) between solders and substrates. Our previous works investigated the effects of minimal rare earth (RE) elements addition on the interfacial IMCs under different aging time. Experimental results showed that the appropriate RE content is 0.07wt% La in Sn-0.3Ag-0.7Cu...
MR diffusion tensor imaging (DTI) has been successfully used to characterize myocardium structure in numerous studies. Recently, conventional DTI has been demonstrated to need optimization in describing brain microstructure as water diffusion in such kind of complex biological tissue is not a free Gaussian process, which conflicts with the basic assumption of conventional DTI that diffusion weighted...
The effects of the fourth Ni element on microstructure and monotonic shear strength of Sn-3.0Ag-0.5Cu lead-free solder were investigated. The addition of the Ni element makes the new (CuxNi1-x)6Sn5 phase, which improves the solder microstructure. The results indicate that the addition of Ni element increases the shear strength of solder joint. When the content of Ni is 0.10 wt.%, the shear strength...
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