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In this paper we examine the thermo-mechanical reliability of polymer-encapsulated chip-on-board (COB) assemblies for power applications by simulation and experiment. Thereby the focus is set on the low cycle fatigue failure behaviour of the die-attach material under thermal cycling conditions. As die-attach material different solder materials and Ag-filled thermal adhesives have been used. The encapsulation...
A modular and parametric approach to FE-modelling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue. Thereby the method of automatic model generation by modular parametric modelling is outlined and some examples featuring the required solution techniques...
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