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A new DBC-based hybrid packaging and integration method is proposed in this paper. A multilayer power module is formed by a direct-bond-copper (DBC) and a window cutting printed circuit board (PCB). The SiC chips and PCB are placed and soldering on the DBC. Al bonding wires are used for connecting the chips and the PCB. A full SiC half-bridge power module is designed and fabricated in compact size...
A beam-steering array operating in the 28-GHz band is described, including a 1-by-4 patch antenna array, liquid crystal (LC) based microstrip meander line phase shifters and feeding networks. The RF signal is coupled to the patch antenna array from the slots in the ground plane. The LC phase shifters are implemented in a kind of inverted microstrip line (IMSL) topology by filling liquid crystal between...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated. Cu6Sn5 and Cu3Sn were the two key intermetallic compounds (IMCs) that formed at the interface. On (111) Cu substrate, prism-like Cu6Sn5 grains could be observed after reflowing at 250°C for 10s. On polycrystalline Cu substrate, only scallop-like Cu6Sn5 grains...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated. Cu6Sn5 and Cu3Sn were the two key intermetallic compounds (IMCs) that formed at the interface. On (111) Cu substrate, prism-like Cu6Sn5 grains could be observed after reflowing at 250°C for 10s. On polycrystalline Cu substrate, only scallop-like Cu6Sn5 grains...
An antenna switch module using PIN (P region-I region-N region) diode for GSM (Global System for Mobile communications) application has been designed and fabricated. By taking advantage of three-dimensional integration of the LTCC (low-temperature co-fired ceramic) substrate and through a novel design of miniature lumped-element realization of transmission line, the size of proposed GSM switch is...
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