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Linear elastic fracture mechanics (LEFM) approach was used for studying the influence of the interfacial IMC layer thickness and solder mask layer thickness on fracture behavior of ball grid array (BGA) structure solder interconnects using finite element numerical simulation. The stress intensity factors (SIFs, KI and KII) at the crack tip of a predefined face-crack in the IMC layer of BGA joints...
In this study, a parametric study of the stress intensity factors (SIFs, KI and KII) at the crack tips of predefined cracks in the IMC layers of ball grid array (BGA) structure joints was performed using linear elastic fracture mechanics (LEFM) method through finite element (FE) simulation. It has been shown that the crack driving force KI is much larger than KII regardless of the crack length, contact...
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