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The package-on-package (PoP) stacking assembly is a member of the SiP family. It is constructed by individual fabricated and tested packages from the same or different supplier provided in a stacked structure through solder joints. It can reduce the placement and routing areas on board and also allow one defective component to be replaced which is opposite to case of stacked Chip Scale Package (CSP)...
System in Package (SiP) technology is rapidly evolved from specialty technology used in a narrow set of applications to a high volume technology with wide ranging impact on electronics markets. Numerous concepts for three dimensional (3D) SiP packaging are now emerging driven largely by the demands of portable consumer products. Conventional failure analysis techniques face a great challenge for SiP...
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