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For the last few decades semiconductor industry has been following Moore Law effectively, which has resulted in significant miniaturization of transistors and chip logic circuitry, and the development of 3D integration technology. While due to the large size and extremely thin of chip and interposer, increasingly attention has been payed to the warpage, which was regarded not only decide the assembly...
In this paper, a full channel simulation model of interposer and organic substrate is established. The TSV (through silicon via) interposer provides high-bandwidth, low-latency interconnection to accomplish higher performance and reach smaller size of the semiconductor devices. For 2.5D packaging, it's extremely necessary and pressing to estimate the electrical property and optimize the structure...
Flip-chip ball grid array (FCBGA) packaging was developed to meet the requirements of high I/O density and high electrical performance and the trend of persistent miniaturization of electronic products. Underfill is usually used in flip-chip packaging to fill the gap between the silicon die and the substrate to provide solder bumps protection, compensation of the coefficient of thermal expansion (CTE)...
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