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As modern electronics move towards miniaturization, high-degree integration and multifunctionalization, a large amount of heat will be generated during the operation of electronic devices. Redundant heat will cause the failure of electronic devices. One important solution is to fabricate thermally conductive composites to replace conventional packaging materials. Herein, we report on fabrication of...
Al2O3 coated graphene foam (GF@Al2O3) composites are proposed by depositing insulating Al2O3 particles on the graphene with a simple method. The content of Al2O3 on graphene could be gradually adjusted by changing Al(OH)3 radio in solution. Al2O3 coated graphene foam composites are used as effective three dimension (3D) interconnected framework of paraffin phase change materials to increase thermal...
Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
Heat generated by electronic devices and circuitry must be dissipated to improve their performance, reliability and prevent the premature failure. One of important methods is to fabricate composites with high thermal conductivity. In this study, we develop a novel approach for surface modification of boron nitride nanosheets and silicon nanowires by being decorated with silver nanoparticles. The resultant...
Vertically aligned carbon nanotube (VACNT) has been proposed as a promising material for electrical interconnection and heat dissipation, because of its high electrical and thermal conductivity. Defects and impurities in synthesized VACNT, however, lead to unsatisfactory performance in these applications. To improve the quality of VACNT, we systematically studied the effects of various growth parameters...
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