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In this paper, we reported the performances of epoxy conductive adhesives filled with a low-melting-point Sn-Bi-Ag alloy. Results revealed the excellent stability, mechanical property of the Sn-Bi-Ag epoxy adhesives. Meanwhile, the thermal conductivity increased by increasing the content of Sn-Bi-Ag filler and 18 W m−1 K−1 can be obtained with 85% Sn-Bi-Ag filler content.
Electroplating is used here to fabricate a SnAgCu eutectic solders coating on copper substrate. The optimized coating is composed of Sn, Ag and Cu with the weight ratio of 96.4∶3.0∶0.6. Its melting temperature was confirmed at 215–220 °C. The coating thickness was controlled at 10 µm and its thermal conductivity reaches up to 56.7 W/mK.
This paper studies the silicone based materials used for light emitting diode (LED) packaging. A phenyl vinyl silicone resin (PVS) with high refractive index was synthesized in this paper. Four types of packaging materials were prepared by a hydrosilylation reaction between PVS and hydride silicone materials. This study focuses on the thermo and dynamic mechanical properties of the packaging materials...
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